Determination of Thermogravimetric Analysis and Dynamic Mechanical Analysis Properties of Epoxy Resin Glass Fiber Reinforced Composite Reinforced with Silicon Carbide and Boron Nitride Hybrid Nanopowders
Project no. 32732 · Status: Kapanmış · 2024
Summary
<p>Over the past half-century, faster, cheaper computing, and the long-associated demands for increased device density and progressive device miniaturization, have driven scientists and engineers to continually develop new and ever-improving materials, tools, processes, and design methodologies. Electronic devices and their applications have been among the fastest-advancing fields, with characteristic device dimensions surpassing the microscope and shrinking to the nanoscale in just two decades. Today, many modern electronic devices operate at critical dimensions of tens of nanometers. Furthermore, the rise of mobile devices and touchscreen applications has driven new research and development efforts into devices and materials compatible with transparent and/or flexible substrate design requirements. However, these exciting technological advances and emerging applications also create thermal challenges that can ultimately serve to limit their effectiveness, scope of application, or overall feasibility. Thermal dissipation is critical to the performance, lifetime, and reliability of electronic devices. With the miniaturization, integration, and functionalization of electronics, and the emergence of new applications such as 3D chip stack architectures, flexible electronics, and light-emitting diodes, thermal dissipation is becoming a challenging problem. Therefore, new materials with high thermal conductivity are needed to help overcome this challenge.</p><p><br></p><p>This project aims to experimentally determine the thermal properties of a glass fiber-reinforced composite reinforced with silicon carbide (SiC) and hexagonal boron nitride (h-BN) and epoxy resin. The combination of different fillers has recently proven to be a viable strategy for increasing the thermal conductivity of composites. It will be determined at which weight percentages the combined reinforcement effect provides better thermal properties compared to a pure glass fiber/epoxy composite. The hybrid filled (SiC and h-BN) glass fiber/epoxy composites will be produced using the vacuum-assisted hand lay-up method. During the composite material production process, the weight percentage of h-BN nanopowder will be kept constant at 1%, and the weight percentages of SiC nanopowder will be varied to 0%, 1%, 2%, and 3%.</p>